Matching Wafer:
B1271WV-S-F-2xXP (1.27mm Pitch，180°，Dual Row，Foot，SMT Wafer)
B1271WR-S-F-2xXP (1.27mm Pitch，90°，Dual Row，Foot，SMT Wafer)
| Product General Info | Category | Board To Board | ||
| Assembly Type | Wafer | |||
| Pitch (mm) | 1.27mm | |||
| Product Series | AB1271 Series | |||
| Configuration Features | Number of Rows | 2 | ||
| Number of Positions | 2x6P~2x40P | |||
| Electrical characteristics | Operating Voltage (V AC/DC) | 250 | ||
| Current (Max)(A) | 0.5 | |||
| Contact Resistance | 20mΩMax | |||
| Insulation Resistance | 100MΩMin | |||
| Shell characteristics | Housing Material | LCP, UL94V-0 | ||
| Color | Black | |||
| PIN Material | Phosphor Bronze | |||
| PIN Plating | Gold and Tin over Nickel | |||
| Environmental Info | Operating Temperature Range (°C) | -40℃~105℃ | ||
| Industry Standard | UL/CUL | |||
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Pitch: 1.27mm
Pitch: 1.27mm
Pitch: 1.27mm
Pitch: 1.27mm
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